DBS

GLUE DISPENSING & ADHESIVE DIE BONDER

The architecture of the DBS machine allows a more compact and stable system by having the glue dispensing system on the left side and the die pick places on the right side.

  • Compatible with non-standard product dimensions
  • Customized conveying system
  • Wafer and Tape & Reel Feeder
  • Integrated glue dispenser
  • Accurate component placement

DLS

LASER SELECTIVE SOLDERING DIE BONDER

The DLS machine allows several stations to work in parallel to optimize floor-space.

  • Laser selective heating system
  • Quick and precise temperature rise
  • Up to +/-1g force placement
  • Holding component during soldering
  • Repeatable post bonding position

ILAS

LASER SELECTIVE SOLDERING/SINTERING DIE BONDER

This special machine is more specifically designed to assist laoratories in the development of innovative assembly process. It can cover a wide range of product types.

  • Complete access to process parameters
  • Process analysis and post treatment functionality
  • Laser heating system
  • Flexible platform

Your solution

Thanks to our 20 years experiences as a special machine builder, we can design customized machines and complete assembly lines for your back-end application. Most of our machines are conceived for mass production. Please contact us: