DBS GLUE DISPENSING & ADHESIVE DIE BONDER
The architecture of the DBS machine allows a more compact and stable system by having the glue dispensing system on the left side and the die pick places on the right side.
Compatible with non-standard product dimensions Customized conveying system Wafer and Tape & Reel Feeder Integrated glue dispenser Accurate component placement DLS LASER SELECTIVE SOLDERING DIE BONDER
The DLS machine allows several stations to work in parallel to optimize floor-space.
Laser selective heating system Quick and precise temperature rise Up to +/-1g force placement Holding component during soldering Repeatable post bonding position ILAS LASER SELECTIVE SOLDERING/SINTERING DIE BONDER
This special machine is more specifically designed to assist laoratories in the development of innovative assembly process. It can cover a wide range of product types.
Complete access to process parameters Process analysis and post treatment functionality Laser heating system Flexible platform
Thanks to our 20 years experiences as a special machine builder, we can design customized machines and complete assembly lines for your back-end application. Most of our machines are conceived for mass production. Please contact us: