Whatever you need a fully automated production line or a stand alone lab platform, ISP System modular architecture offers bespoke and highly configurable die bonding and micro assembly solution to fully meet your need. Please find some of the already developed function blocks we can propose for your application:
<5 MICRO METER TILT CORRECTION
SUB-MICRONIC COMPONENT PLACEMENT
LASER SELECTIVE HEATING
Lense/ferule assembly
TIME/PRESSURE DISPENSING
WAFER COMPONENT SUPPLY
TAPE & REEL COMPONENT SUPPLY
DIE-BONDING
SOLDERING
GLUEING
Silver sintering
More information
We can provide you with fully customized micro-assembly machines. Please be free to contact us to find out what is the best configuration for your application.