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DIE BONDING &
MICRO-ASSEMBLY MACHINES

Whatever you need a fully automated production line or a stand alone lab platform, ISP System modular architecture offers bespoke and highly configurable die bonding and micro assembly solution to fully meet your need. Please find some of the already developed function blocks we can propose for your application:

+/- 1g component placement force control

icon component placement force control

<5 micro meter tilt correction

icon 5micron m tilt correction

Sub-micronic component placement

icon sub micronic component placement

Laser selective heating

icon laser selective heating

Lense/ferule assembly

icon lense ferule assembly

Time/pressure dispensing

icon time pressure dispensing

Wafer component supply

icon wafer component supply